cooling MACS – MHS WEBSITE

MACS Micro Aqua Cooling System

Innovative Microchannel Cooling: Transcending the Limits of Thermal Control.

The essence of thermal control lies in how extensively and closely the coolant interacts with the heat source. Microchannels subdivide flow paths into microscopic dimensions to dramatically expand the contact surface area. This architecture shortens the heat transfer path, enabling rapid and highly efficient heat dissipation.

Why Microchannel Cooling

Why Microchannel Technology Matters

Thin Liquid Cooling

Microchannel-based Ultra-slim Liquid Cooling System

MICRO AQUA

MACS is an innovative thin-plate liquid cooling system powered by advanced microchannel technology.

By subdividing coolant flow into dozens or even hundreds of micro-paths, it maximizes heat transfer efficiency to its full potential.

This technology offers an optimized cooling solution specifically engineered for high-density heat sources with small, flat surfaces, such as semiconductor chips.

COOLING SYSTEM

Application of MACS

High-Efficiency Liquid Cooling Solutions for Versatile Form Factors

Available in various configurations, MACS provides precise thermal control to ensure stable operating temperatures, maximizing both equipment performance and longevity.

Its superior cooling efficiency simultaneously reduces operational costs, noise levels, and installation footprint, significantly enhancing user convenience.

Semiconductor Chips
Targeting high-density heat at the source.

Capillary-driven High-efficiency Liquid Cooling System
Rapid Heat Dissipation via Micro-channel Architecture
Significant Performance Boost through Enhanced ΔT Management
Ultra-slim Profile for Expanded Application Versatility

Heat Sink Module
Air-cooled convenience with liquid-cooled performance.

PCIe Slot-mountable Design
Liquid-cooling-level Performance in an Air-cooled Form Factor
Seamless Direct Replacement for Existing Air-cooled Server Heat Sinks
Optimized for High-heat Components: AI GPUs and AIBs

Radiator
Maximizing thermal exchange in a compact footprint.

30% Increase in Cooling Efficiency via Expanded Heat Transfer Area (CFD Verified)
Reduced Rear-mount Burden through Compact and Lightweight Engineering
Enhanced Space Utilization and Operational Efficiency
Proven Energy Saving Effects

MACS vs Other Liquid Cooling

MACS vs. Conventional Liquid Cooling Systems

MACS delivers superior cooling efficiency by significantly reducing thermal resistance and expanding the heat exchange surface area compared to traditional liquid cooling.

Its multi-path microchannel branching architecture enables faster and more voluminous heat removal under identical conditions. This results in far higher cooling performance per unit volume than conventional radiators that rely on thick tubes and louver fins.

MACS

Cold Plate

Radiator

Conventional Liquid Cooling

Cold Plate

Radiator

Cooling Beyond Limits

The Next Generation of Cooling: Reliable, Powerful, Proven

MACS goes beyond the limits of legacy systems. We provide high-performance liquid cooling solutions that guarantee reliability for the next generation of high-heat technology.

MHS Patents

MHS Cooling Technology: Validated by a Robust Patent Portfolio

We safeguard our core innovations through a comprehensive suite of foundational and applied patents. This ensures the reliability, scalability, and exclusive competitive edge of our real-world cooling solutions.

Foundational Patent: Thin-plate heat exchange device using microchannels (MACS)

(1 Registered Patent)

Cooling structures for high-performance processing cards

(High-performance legacy heatsinks) (2 Registered Patents)

Liquid cooling systems for AI semiconductors

(MACS-powered) (1 Registered Patent)

Thermoelectric modules and air conditioning systems (Eco-friendly AC utilizing MACS)

(Eco-friendly AC utilizing MACS) (1 Registered Patent)

Interference-Avoidance Cold Plate Assembly

(Cold plates for inverters using MACS) (1 Domestic Patent Application Pending)