PRODUCT
COMPANY
NEWSROOM
CAREER
SUPPORT

MACS Micro Aqua Cooling System

Next-Generation Microchannel Cooling

Microchannels maximize coolant contact, enabling rapid heat removal through shorter transfer paths.

Why Microchannel Cooling

The Need for Microchannel

Thin Liquid Cooling

Thin-Plate
Liquid Cooling System

MICRO AQUA

MACS is a thin-plate liquid cooling system that uses microchannels to divide coolant flow, maximizing heat transfer area.

Maximizes cooling performance within a thin structure, making it ideal for concentrated heat sources.

It meets thermal demands of high-density electronics and reduces localized overheating.

COOLING SYSTEM

 

Application of MACS

Microchannel Thin-Plate Cooling

The microchannel-based thin-plate liquid cooling solution enables close coolant contact with the heat source through finely structured flow paths.

It enables high heat removal in thin structures while ensuring stable temperature control for high-density electronics

Semiconductor Chip

· High-efficiency liquid cooling system utilizing Capillary Action to minimize input loss. · Micro-channel design enables superior heat transfer efficiency and rapid heat dissipation (CFD validated) · Increased outlet temperature differential (ΔT) compared to conventional Cold Plates, resulting in enhanced heat removal capacity and significantly improved performance. · Reduced cold plate thickness allows stackable design configurations.
Semiconductor Chip

Integrated Liquid Cooling

· Designed for installation in standard PCIe slots. · Delivers liquid cooling performance within a conventional air-cooling form factor. · Direct replacement for heatsinks installed in existing air-cooled servers. · Applicable to high-heat-generating components such as high-performance AI GPUs and AIB graphics cards.
Integrated Liquid Cooling

Radiator

· 30% improvement in cooling efficiency compared to conventional products through significantly increased heat transfer area (CFD validated). · Compact and lightweight design reduces rear rack installation burden and improves space utilization. · Enhances energy savings and overall operational efficiency.
Radiator

MACS vs Other Liquid Cooling

Compared to Conventional Liquid Cooling

MACS delivers higher cooling efficiency through reduced thermal resistance and increased heat exchange area compared to conventional liquid cooling systems.

Its multi-microchannel structure provides superior cooling performance over conventional tube-and-louver fin radiators within the same volume.

MACS

발열파트 Cold Plate

냉각파트 Radiator

Conventional Liquid Cooling

발열파트 Cold Plate

냉각파트 Radiator

Cooling Beyond Limits

A New Standard in Thermal Control

MACS delivers reliable next-generation cooling beyond conventional limits.

MHS Patents

Patent-Proven Cooling Technology

Core technologies are protected by foundational and applied patents, ensuring reliable and scalable cooling solutions for real-world use.

Microchannel-Based Thin-Plate Heat Exchanger (MACS)
  • Core Patent (1 Patent Registered)
Cooling Structure for High-Performance Processing Cards
  • Manufacturing Technology for High-Performance Legacy Heatsinks(2 patent registered)
Liquid-Cooling System
  • Cooling Technology for AI Semiconductors Using MACS(1 patent registered)
Air Conditioning System Incorporating a Thermoelectric Module
  • Eco-Friendly Air Conditioner Using MACS(1 patent registered)
Interference-Avoidance Cold Plate Assembly
  • Inverter Cold Plate Using MACS(Domestic patent application in progress)
Scroll to Top