It meets thermal demands of high-density electronics and reduces localized overheating.
Microchannels maximize coolant contact, enabling rapid heat removal through shorter transfer paths.
Why Microchannel Cooling
The Need for Microchannel
Thin Liquid Cooling
Thin-Plate
Liquid Cooling System
MICRO AQUA
MACS is a thin-plate liquid cooling system that uses microchannels to divide coolant flow, maximizing heat transfer area.
Maximizes cooling performance within a thin structure, making it ideal for concentrated heat sources.
COOLING SYSTEM
Application of MACS
Microchannel Thin-Plate Cooling
The microchannel-based thin-plate liquid cooling solution enables close coolant contact with the heat source through finely structured flow paths.
It enables high heat removal in thin structures while ensuring stable temperature control for high-density electronics
Semiconductor Chip
· High-efficiency liquid cooling system utilizing Capillary Action to minimize input loss. · Micro-channel design enables superior heat transfer efficiency and rapid heat dissipation (CFD validated) · Increased outlet temperature differential (ΔT) compared to conventional Cold Plates, resulting in enhanced heat removal capacity and significantly improved performance. · Reduced cold plate thickness allows stackable design configurations.
Integrated Liquid Cooling
· Designed for installation in standard PCIe slots. · Delivers liquid cooling performance within a conventional air-cooling form factor. · Direct replacement for heatsinks installed in existing air-cooled servers. · Applicable to high-heat-generating components such as high-performance AI GPUs and AIB graphics cards.
Radiator
· 30% improvement in cooling efficiency compared to conventional products through significantly increased heat transfer area (CFD validated). · Compact and lightweight design reduces rear rack installation burden and improves space utilization. · Enhances energy savings and overall operational efficiency.
MACS vs Other Liquid Cooling
Compared to Conventional Liquid Cooling
MACS delivers higher cooling efficiency through reduced thermal resistance and increased heat exchange area compared to conventional liquid cooling systems.
Its multi-microchannel structure provides superior cooling performance over conventional tube-and-louver fin radiators within the same volume.
MACS
발열파트 Cold Plate
냉각파트 Radiator
Conventional Liquid Cooling
발열파트 Cold Plate
냉각파트 Radiator
Cooling Beyond Limits
A New Standard in Thermal Control
MACS delivers reliable next-generation cooling beyond conventional limits.
MHS Patents
Patent-Proven Cooling Technology
Core technologies are protected by foundational and applied patents, ensuring reliable and scalable cooling solutions for real-world use.
Microchannel-Based Thin-Plate Heat Exchanger (MACS)
- Core Patent (1 Patent Registered)
Cooling Structure for High-Performance Processing Cards
- Manufacturing Technology for High-Performance Legacy Heatsinks(2 patent registered)
Liquid-Cooling System
- Cooling Technology for AI Semiconductors Using MACS(1 patent registered)
Air Conditioning System Incorporating a Thermoelectric Module
- Eco-Friendly Air Conditioner Using MACS(1 patent registered)
Interference-Avoidance Cold Plate Assembly
- Inverter Cold Plate Using MACS(Domestic patent application in progress)